Monolithic three-dimensional tier-by-tier integration via van der Waals lamination. (https://pubmed.ncbi.nlm.nih.gov/38778106/)

These scientists found a new way to stack many layers of tiny electronic circuits on top of each other, like building a tall tower out of Legos. They used special materials called two-dimensional semiconductors that are very thin and flexible. Normally, these materials can't handle high temperatures, which makes it hard to stack them up in many layers.

But these scientists figured out a way to do it at a low temperature of 120 degrees Celsius by using a method called van der Waals lamination. This method involves carefully layering the circuits on top of each other like stacking pancakes. They were able to stack up to 10 layers of circuits on top of each other without damaging the bottom layer.

By connecting the circuits in different layers together, they were able to create complex electronic systems with different functions, like making a robot that can move or a computer that can play games. This new method allows scientists to build taller and more complex electronic towers with many layers of circuits, opening up exciting possibilities for future technology!

Lu D., Chen Y., Lu Z., Ma L., Tao Q., Li Z., Kong L., Liu L., Yang X., Ding S., Liu X., Li Y., Wu R., Wang Y., Hu Y., Duan X., Liao L., Liu Y. Monolithic three-dimensional tier-by-tier integration via van der Waals lamination. Nature. 2024 May 22. doi: 10.1038/s41586-024-07406-z.

ichini | 3 weeks ago | 0 comments | Reply